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We are studying Photonic Integrated Circuits.   ▷Japanese

7-1, Kioi-cho, Chiyoda-ku, Tokyo 102-8554
Room 4-275A

Equipments

We explain our device study from design, fabrication to measurement with equipments

Device design and mask pattern fabrication

First is the design of optical device. Optical waveguide mask pattern is fabricated by using BPM cad or Fortran program.

Crystal growth

The performance of optical device is almost determined by the growth of waveguide wafer.
Metal organic vapour phase epitaxy system is used for the crystal growth. In, Ga, Al, As, P compound semiconductor material growth is possible. Precursors are TMI, TEG, TMA, TBA, TBP, and p-, n- type dopant are DEZ and DTBSi. Ozon cleaner is used for the wafer cleaning before growth, and Helium leak detector is used for leakage check of the system.


SiO2 CVD

SiO2 film is necessary in the semiconductor process as a etching mask or insulator as a elctrode isolation. We have introduced the Plasma CVD using TEOS.


Lithography

Optical waveguide is patterned on the wafer by photo lithography system (MJB4) using glass mask.


Etching

Optical waveguide is fabricated using wet chemical etching or dry etching by using the photo lithographied pattern.


Electrode fabriation

Original wafer is thinned by the lapping system for the ease of cutting of device. Electrode is evaporated by the evaporator with resistance heating or electron beam evaporator. Evaporated metal is annealed to reduce the electrical resitance between metal and semiconductor. Dye bonder or wire bonder is used for the package.


Structure measurement

Quantum dots structure are measured by atomic force microscope.
Waveguide thickness or the step height is measured by laser microscope.

Photoluminescence

Absorption edge of the wafer is measured by Photoluminescence measurement.

Electrical measurement

Current voltage characteristics is measured by source measure unit. Electrical characteristics such as MOSFET is measured using prover. Current voltage or current light characteristics are measured by pulse I-L tester.

Near field pattern measurement

Near field pattern, that is the output light intensity from the device is measured by NFP measurement system. Tunable laser is used as input light, and the ouput light pattern is observed by visicon camera and optical power is measured by power meter.



バナースペース

Shimolab

7-1, Kioi-cho, Chiyoda-ku,
Tokyo 102-8554
Room 4-275A